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Price:
Please contact Sales
Department at
sales@amtron.com,
phone (323) 265-8076, or fax (323) 488-9747, to inquire the most updated pricing and lead time. ■ 3D pSLC [ 0°C to +70°C ]
* Firmware sets aside some more space for Over-Provisioning (OP) technology to optimize the wear leveling (WL), garbage collection (GC), bad block management (BBM) operations, in order to increase the life of NAND flash memory. This method reduces the data storage space, but increase the CFexpress card life. ■ 3D pSLC [ -40°C to +85°C ]
* Firmware sets aside some more space for Over-Provisioning (OP) technology to optimize the wear leveling (WL), garbage collection (GC), bad block management (BBM) operations, in order to increase the life of NAND flash memory. This method reduces the data storage space, but increase the CFexpress card life. ■ 3D TLC [ 0°C to +70°C ]
* Firmware sets aside some more space for Over-Provisioning (OP) technology to optimize the wear leveling (WL), garbage collection (GC), bad block management (BBM) operations, in order to increase the life of NAND flash memory. This method reduces the data storage space, but increase the CFexpress card life. ■ 3D TLC [ -40°C to +85°C ]
* Firmware sets aside some more space for Over-Provisioning (OP) technology to optimize the wear leveling (WL), garbage collection (GC), bad block management (BBM) operations, in order to increase the life of NAND flash memory. This method reduces the data storage space, but increase the CFexpress card life.
Warranty
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